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Catalog/Samsung/DDR4 RDIMM/M393A4K40BB0-CPB
Samsung · Server memory

M393A4K40BB0-CPB

32 GB DDR4-2133 ECC Registered DIMM (RDIMM), dual-rank ×4. Sold by Dell under its own part numbers, all cross-referenced below.

Specs from the moderated catalog How we verify →
Specifications JEDEC / manufacturer data
Memory typeDDR4catalog
Module typeRDIMM · ECC Registered DIMMcatalog
Capacity32 GBcatalog
SpeedDDR4-2133 · PC4-17064catalog
Organization / rank2Rx4catalog
Voltage1.2 VJEDEC standard for DDR4
Form factor288-pin DIMMstandard for DDR4 RDIMM
OEM part numbers same module, OEM-branded
VendorOEM part numberVerification
Dell99L0430-001.A00catalog
OEM cross-references are compiled from distributor cross-reference data and OEM documentation. Verify against your vendor's parts list before ordering.
Compatible alternatives same JEDEC specification
ManufacturerPart numberSpec
MicronMTA36ASF4G72PZ-2G1B1RK32 GB · DDR4-2133 · RDIMM · 2Rx4
SamsungM393A4K40BB0-CPB0Q32 GB · DDR4-2133 · RDIMM · 2Rx4
SK hynixHMA84GR7AFR4N-TF32 GB · DDR4-2133 · RDIMM · 2Rx4
SK hynixHMA84GR7MFR4N-TF32 GB · DDR4-2133 · RDIMM · 2Rx4
Modules match on all key specifications (type, form factor, capacity, speed, rank organization) and are generally interchangeable in servers that accept this spec. Interchangeability is based on matching JEDEC specifications, not per-server testing. Confirm against your server vendor's qualified parts list. View the full family →
Frequently asked
Is Dell 99L0430-001.A00 the same module as M393A4K40BB0-CPB?
Yes. Dell resells this Samsung module under part number 99L0430-001.A00. The physical module is identical: OEM part numbers are branding, not different hardware.
Can I use a Micron or Samsung module instead?
In most servers, yes: MTA36ASF4G72PZ-2G1B1RK (Micron), M393A4K40BB0-CPB0Q (Samsung), HMA84GR7AFR4N-TF (SK hynix) match this module on every key specification (32 GB, DDR4-2133, RDIMM, 2Rx4). Keep vendors consistent within a memory bank, and check your server's qualified parts list for edge cases.
What does 2Rx4 mean?
Two ranks of DRAM chips, each 4 bits wide ("×4"). Rank organization affects how many modules a memory controller can drive at full speed, so it's listed as a key spec.